Equals Darnell's Power Forum Plus Green Building Power Forum Plus Smart Grid Electronics Forum
Darnell's Energy Summit

Diamond Sponsor:
Face International Corporation

Hosting Sponsor:
Virginia Commonwealth University

Gold Sponsor:
Alta Devices


Conference Schedule

The following is a tentative schedule and subject to change. Click here to Register NOW!

Tuesday, September 23rd
8:00 – 9:30 a.m.

Registration & Continental Breakfast

9:30 – 10:15 a.m.

Keynote Presentation

Mary Doswell
Senior Vice President - Retail and Alternative Energy Solutions, Dominion Power

Transitioning to a Next-Generation Energy System

A convergence of technologies is set to transform the electric grid. This keynote address will examine the potential promise, as well as the challenges, of emerging generation, transmission, and distribution technologies.

10:15 a.m. – 12:15 p.m.

Plenary Session I

1.1: A review of Energy Harvesting Materials and Techniques, Karla Mossi, Ph.D., Graduate Program Director, Mechanical and Nuclear Engineering Department, School of Engineering, Virginia Commonwealth University

1.2: GaAs Powering Forward, Bob Conner, CEO, Founder, Sarda Technologies, Inc.

1.3: GaN Transistors - Giving New Life to Moore's Law, Alex Lidow, CEO, Efficient Power Conversion Corporation

1.4: Aluminum Nitride for High-Voltage Power Electronics, Baxter Moody, Director of Device Development, HexaTech, Inc.

12:15 – 1:45 p.m.


1:45 – 3:45 p.m.

Plenary Session II

2.1: Silicon Carbide Power Electronics for Energy Applications: Perspectives, Targets, and the path to Applications through European Union SPEED Project, Dr. Daniel Fernández, CTO of INAEL Electrical Systems and Coordinator of Project SPEED

2.2: European Union DCC+G (DC Components +Grid) Project, an Update, Bernd Wunder, Fraunhofer Institute and BJ Sonnenberg, Emerson Network Power

2.3: Smart Grid 2.0: The Energy Internet, Alex Huang, Progress Energy Distinguished Professor, North Carolina State University

2.4: The Integrated Grid: Realizing the Full Value of Central and Distributed Energy Resources, Brian Fortenbery, Program Manager, Electric Power Research Institute (EPRI)

3:45 – 4:00 p.m.

Networking Break

4:00 – 5:00 p.m.

Round Table Discussion  —  "Where Does SiC Fit?"

Silicon-Carbide (SiC) appears to be the "most mature" of the new semiconductor materials vying for a place in next-generation power converters. Where will it bring the most value? Where will other new materials be the better choice to replace Silicon? How soon will this become reality? Join our panel of experts in a lively discussion of advanced materials for power conversion!

Moderator: Alex Huang, Progress Energy Distinguished Professor, North Carolina State University

Dr. Daniel Fernández, CTO of INAEL Electrical Systems and Coordinator of Project SPEED
Jeffrey Cassidy, Vice President, Cree, Inc.
Baxter Moody, Director of Device Development, HexaTech, Inc.
Alex Lidow, CEO, Efficient Power Conversion Corporation
Carl Blake, Vice President, Transphorm, Inc.

5:00 – 7:30 p.m.

Exhibit Hall Open to Full Conference Delegates and "Exhibits Only" Delegates

Hosted Reception (hosted in exhibit hall)

Wednesday, September 24th
8:00 – 9:00 a.m.

Registration and Continental Breakfast

9:00 a.m. – 12:00 p.m.

Session 3 - Energy Harvesting Roundtable

3.1: Multi-source Energy Harvesting Using Neural Networks, Christopher Green, Mechanical Engineer, Naval Surface Warfare Center, Dahlgren

3.2: Energy Harvesting Developments at U.S. Army Research Laboratory, Natick Soldier RD&E Center (NSRDEC), and Communications-Electronics Center RD&E (CERDEC), Dr. Christopher Meyer, Electrical Engineer, U.S. Army Research Laboratory

3.3: Energy Harvesting with Thunder and Lighting High-Deformation Piezo-ceramics, Jeff Rogers, The Face Companies

3.4: Energy Harvesting for Wireless Sensors, Sam Cowley, Director of Product Engineering, Alta Devices

Roundtable Discussion

Session 4 - GaN Power Devices Roundtable

4.1: Pushing the State-of-the-Art in High-Frequency Hard-Switching Converters using eGaN®FETs, Johan Strydom, VP Applications Engineering, Efficient Power Conversion Corp.

4.2: HV GaN, Just How Reliable is this New Material?, Carl Blake, Vice President, Transphorm, Inc.

4.3: 600V GaN Cascode Switches Drive Advanced Power Supply Topologies, Eric Persson, Executive Director GaN Applications and Marketing, International Rectifier Corp.

4.4: Wide Band Gap Power Device Evaluation Challenges and Technologies, Ryo Takeda, Senior Product Planner, Keysight subsidiary, Agilent Technologies, Inc.

Roundtable Discussion

Session 5 - 380Vdc Powering Roundtable

5.1: Overall Industry Update; Standards, System Component Availabilities and Future Trends, Dave Geary, Starline DC Solutions

5.2: World-Wide Connector Standards and Product Updates, Brian Davies, Anderson Power Products

5.3: Development of Appliance Coupler for 380-Vdc Data Centers, Bob Thorton, President/COO, Fujitsu Components America

5.4: Worldwide Power Conversion and Product Update and Trends, BJ Sonnenberg, Emerson Power

Roundtable Discussion

12:00 – 2:00 p.m.

Hosted Lunch - Exhibit Hall Open

2:00 – 5:00 p.m.

Session 6 - Designing for the Smart Grid

6.1: Power Electronics in the Smart Distribution Grid, Sandeep Bala, Principle Scientist, ABB Group

6.2: Hardening Command and Control Communications of the SCADA systems against Electromagnetic Environmental Effects (E3) ( Including HEMP, and Geomagnetic Storm ), Bill Magee, Senior Program Manager E3 Solutions, Smiths Power

6.3: High-Speed Digital Isolation Technology Enabling Real-Time Monitoring of Networked Power Systems, Faisal Ahmad, Vice President, Akros Silicon

6.4: Using Advanced Meters to Cut Energy Costs and Comply with Green Initiatives, Don Milstein, President/CEO, E-Mon

6.5: Adding Resiliency and Reliability to the Modern Electric Grid via Cyber-Secure Control of Distributed Energy Resources, John Carroll, Business Development Director, IPERC

6.6: Secure Data Storage and Transfer in Embedded Applications, Joe Thomsen, Vice President, MCU16 Division, Microchip Technology Inc.

Session 7 - Portable and Wireless Power

7.1: Performance Comparison using eGaN®FETs in 6.78 MHz class E and ZVS class D Wireless Power Transfer, Michael deRooij, Executive Director Applications Engineering, Efficient Power Conversion

7.2: Man-Portable Hybrid Power Management System, Philip Ufkes, Vice President and CTO, UEC Electronics Mobile

7.3: Energy Harvesting for Portable Devices, Rich Kapusta, Vice President, Alta Devices

7.4: An LLC-Based Planar Wireless Power Transfer System for Multiple Devices, Bingnan Wang, Member Research Staff, Mitsubishi Electric Research Labs

7.5: Trends and Forecasts for Wireless Energy Transfer Systems, Richard Ruiz, Research Analyst, Darnell Group

Session 8 - Micro-Grids

8.1: AC-DC Commercial Building-level Micro Grid for Dispatchable and Uninterruptible Power Delivery, Chris Kuhl, Team Leader, ZBB Energy

8.2: The Customer Advantages of a DC Architecture Mesogrid, Michael Gurin, CEO, CogiTek

8.3: Case Study VCU MicroGrid: Phase I Building Energy Efficiency and Demand Control Complete and Phase II VirtuGrid and Advanced Metering in Development, Dane Honrado, Manager Alternative Energy Generation Technologies, Dominion Resources

8.4: Windpower Generator: Core Efficiency improvements at EFM - Dominion Power Innovation Center, Dane Honrado, Manager Alternative Energy Generation Technologies, Dominion Resources

8.5: The Importance of High-Voltage Energy Storage For Microgrids: Goldilocks Conditions and Engineering, Bill Southworth, CEO, Elecyr

8.6 Load Forecasting Model for Micro-Grid Demand, Zhifang Wang, Ph.D., Assistant Professor Electrical and Computer Engineering, Virginia Commonwealth University

6:00 – 8:00 p.m.

Networking Reception at Rice House, hosted by The Face Companies

Buses will leave from the Convention Center at 5:45.

The Rice House, an important and rare example of modernist architecture in Virginia, was designed by Richard Neutra, one of the most influential architects of the 20th century. Completed in 1965, the elegant structure is magnificently sited on a historic island in the James River, in a complex and beautiful natural environment near the heart of Richmond, Virginia. The house was commissioned by Ambassador Walter and Mrs. Inger Rice, who eventually donated it to the Science Museum of Virginia. The property is listed in the National Register of Historic Places and was renovated in 2011.

Thursday, September 25th
8:00 – 9:00 a.m.

Registration and Continental Breakfast

9:00 a.m. – 12:00 p.m.

Session 9 - Digital Power Design

9.1: Switching-Mode Power Peripherals for Microcontrollers, Keith Curtis, Technical Staff Engineer, Human Machine Interface Division (HMID), Microchip Technology

9.2: Increased Boost Converter Performance & Efficiency Via Non-Linear Control, Demonstrated in an Audio Amplifier, Paul Nichols, Vice President, Cirasys

9.3: Low-cost, Fast and Reliable Code Generation Tools, Keith Curtis, Technical Staff Engineer, Human Machine Interface Division (HMID), Microchip Technology

9.4: Digital Isolator Devices Optimized for Serial Peripheral Interface (SPI) Communications Systems, Steve Daily, Analog Devices, Inc.

9.5: Digital Controlled LLC Resonant Converter Offers High Performance, Laurence McGarry, Analog Devices, Inc.

9.6: Future Growth Opportunities for Digital Power, Richard Ruiz, Research Analyst, Darnell Group

Session 10 - Advanced Components

10.1: Multilayer Liquid-Metal Stretchable Inductors, Nathan Lazarus, Oak Ridge Associated Universities Fellowship Program, US Army Research Laboratory

10.2: Chip-Scale Power Converters with a Focus on Piezoelectric Resonators and Transformers, Dr. Sarah S. Bedair, Electrical Engineer, U.S. Army Research Laboratory

10.3: A Breakthrough Approach to Practical Power and Energy Management through Ultrathin Planar Supercapacitor Arrays, David Rich, Paper Battery Company

10.4: Hybrid Spintronics-Straintronics: Towards Super Energy Efficient Computing Platforms, Jayasimha Atulasimha, Qimonda Associate Professor, Virginia Commonwealth University

10.5: TBA

Session 11 - Developments in Power Conversion

11.1: Portable, Lower-Cost, and Highly-Accurate Analyzer Provides Stability Analysis for PWM Converters and Generic Circuits, Paul Nichols, Vice President, Cirasys

11.2: AC-DC Conversion with PFC, Applying Compound Converter Topologies, Tom Lawson, Founder, CogniPower

11.3: Advances in DC-DC Converters with eGaN FETs, David Reusch, Director of Applications Engineering, Efficient Power Conversion

11.4: Advantages of POL Module or a Power Block Design Approach, William Smith, Director of Marketing, Murata Power Solutions

11.5: A Microcontroller Optimized for Advanced Class 3.5 Switch Mode Power Supplies, Keith Curtis, Technical Staff Engineer, Human Machine Interface Division (HMID), Microchip Technology

12:00 – 2:00 p.m.

Conference Adjourns - Lunch Break

2:00 – 5:00 p.m.

Post-conference Seminar (optional)

GaN Transistors for Efficient Power Conversion, Presented by: Alex Lidow, CEO, EPC Corporation and David Reusch, Director of Applications, EPC Corporation

Gallium Nitride is beginning to be broadly accepted in many power conversion and RF applications. The technology is rapidly developing and product experience in the field is expanding. This seminar will begin with Alex Lidow explaining how GaN High Electron Mobility Transistors (HEMT) work followed by an update on the state-of-the art in the technology from the many new entrants into this field. Included in this update will be the latest manufacturing technologies, cost requirements and comparisons, reliability data and acceleration factors.

David Reusch will follow with a tutorial on how to use these high performance devices. They will start with drivers, layout, and thermal considerations for high performance and high frequency power conversion, and then move to several applications examples including high frequency Envelope Tracking (ET), Class-D Audio, RF amplifiers, DC-DC converters, and Wireless Power Transmission.

The seminar concludes with a look into future of the relatively young technology. For a complete description of this seminar please click here.

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